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  • 新闻稿发布

    • 2025-12-17

    爱普科技扩大S-SiCapTM技术应用版图　满足AI与HPC新需求

    S-SiCapTM产品线涵盖分离式硅电容（Discrete Devices）与硅电容中介层IPC（InterPoser with silicon Capacitor）两大类型，对应不同系统架构与应用情境，满足多元设计需求


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    2025-09-09

    爱普科技 ApSRAMTM开创高性能低功耗存储芯片新方案

    ApSRAMTM为爱普科技虚拟静态随机存取存储芯片(PSRAM)再进阶版本，采用全新架构设计，专为边缘计算与物联网应用打造，提供低功耗、低延迟的高性能存储芯片方案。


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    2024-10-21

    爱普科技独立董事异动公告
    爱普科技发布二则重大讯息，一为独立董事叶瑞斌先生向本公司请辞公司独立董事，另一为法人董事山一投资有限公司法人代表改由叶瑞斌先生担任。
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    2024-06-07

    爱普科技与Mobiveil携手开发UHS PSRAM控制器，提供SoC业者全新解决方案
    爱普 UHS PSRAM拥有更强性能、低功耗、少引脚数特点，瞄准物联网应用场景
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    2024-03-21

    爱普高电容密度硅电容S-SiCapTM Gen3通过客户验证

    全球客制化存储芯片解决方案设计公司爱普科技今日宣布，新一代硅电容(S-SiCapTM, Stack Silicon Capacitor) Gen3已通过客户验证，此产品具备超高电容密度及超薄(<100um薄度)等优势，可在先进封装制程中与系统单芯片(SoC)进行弹性客制化整合，满足客户在高端手机及高性能计算(HPC)芯片的应用需求。


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    2023-11-20

    爱普携手来颉，布局3D封装电源管理
    爱普科技以新台币5亿元取得来颉科技股份有限公司(6799 TW) 4佰万股股份，也期望将爱普3D堆叠先进封装经验和技术进一步推展至电源管理应用领域。
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