爱普,人才,人力资源,高阶主管,高通

爱普科技完成海外存托凭证发行定价,强化未来成长动能

爱普科技成功完成4.16亿美元海外存托凭证发行定价,获国际投资人踊跃认购,募资将充实营运资金,支持三大产品线加速拓展。



爱普科技股份有限公司(以下简称“爱普科技”,股票代码:6531)已于2026年10月12日完成海外存托凭证(GDR)发行定价,募集资金总额达4.16亿美元。本次共发行740万单位GDR,每单位表彰公司普通股2股,预计于卢森堡证券交易所挂牌。每单位GDR的发行价格为56.15美元(折合每股约新台币898元),较当日收盘价新台币947元折价约5.22%。本次募资用途为支应外币购料需求。



本次发行为爱普科技继2022年1月完成1.9亿美元GDR发行后,再度进入国际资本市场。公司于取得主管机关核准后,把握有利市场窗口启动交易,短时间内即获得5倍超额认购,并吸引多家国际知名投资人积极参与,充分彰显资本市场对公司营运前景和中长期增长动能的高度认可。瑞银证券(UBS Securities)担任本次发行之独家全球协调人暨簿记管理人。



爱普科技近期营运表现亮眼,9月营收再创历史新高,达新台币11.9亿元,环比增长15%,同比增长90%,反映公司产品布局逐步显现成效。公司持续聚焦IoT、AI及高效能运算(HPC)等应用领域,受惠于IoTRAMTM供不应求带来的调价效应,以及硅电容产品出货持续增长的双重驱动,营收展现良好成长态势。



IoTRAMTM受惠于标准型记忆体供应短缺,客户加速转向采用定制化IoTRAMTM解决方案,带动应用市场持续拓展;同时,客户陆续导入新一代ApSRAMTM产品,预期将进一步支撑IoTRAMTM需求稳健成长。S-SiCapTM方面,则受惠于AI/HPC芯片功耗大幅提升,先进封装去耦电容需求快速增长。旗下IPC(Interposer with SiCap)系列产品持续放量,IPD(分离式硅电容)亦凭借先行者优势,于今年第二季度正式进入量产出货阶段。随着供应链技术逐步成熟,加之市场供不应求,IPD后续营收表现乐观可期,有望为S-SiCapTM产品线注入强劲成长动能。VHMTM则聚焦高频宽记忆体相关的AI及数据中心推理应用。随着客户产品开发及验证工作持续推进,预计自2028年起陆续进入量产阶段,并开始贡献营收。



本次募资将进一步充实营运资金,以满足公司营运规模快速成长所需的资金周转需求,不仅有助于扩大营收规模与深化市场布局,也将进一步巩固公司中长期成长基础,稳步朝三大产品线营收占比达到1:1:1的长期目标迈进。



新闻联系人:林郁昕财务长暨发言人

电话:+886-3-560-1651

E - mail:ir@apmemory.com


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2026-08-10

爱普科技持续深化全球化布局 引入前高通副总裁张坚加盟

爱普科技今日宣布引入半导体行业资深专家张坚女士加盟公司。未来,张坚将凭借其深厚的全球半导体产业经验,协助公司进一步强化技术研发、产品工程、运营管理及全球客户协同,加速爱普科技全球化战略布局,推动公司迈向新的发展阶段。

搜索
  • IoTRAMTM
  • S-SiCapTM
  • VHMTM
  • 可穿戴式装置
  • 智能家庭
  • S-SiCap 中介層 IP
  • 隐私权政策

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