AP Memory today announced the appointment of Jian Zhang to its leadership team. Jian will apply her extensive global semiconductor experience to help strengthen AP Memory’s technology development, product engineering, operations management, and global customer collaboration, supporting the company’s next phase of growth and global expansion.
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2025-12-17
AP Memory Broadens S-SiCapTM Technology Deployment to Support Evolving AI and HPC Needs
The S-SiCapTM portfolio includes two product categories —discrete silicon capacitors and interposers with silicon capacitors — designed to support different system architectures and diverse application requirements.
2025-09-09
AP Memory Launches ApSRAMTM – A New Low-Power and High-Performance PSRAM
ApSRAMTM is an advanced version of AP Memory’s PSRAM with a new architecture optimized for edge computing and IoT applications, delivering low power consumption, low latency, and high performance.
2024-10-21
Resignation of the Independent Director
AP Memory Technology Corp. announced two major updates today (21st October). Firstly, Independent Director Mr. Yeh, Jui-Pin has submitted his resignation, stepping down from his roles as Independent Director, Audit Committee member, and Compensation Committee member of AP Memory. Secondly, Mr. Yeh will now serve as the representative of the corporate director, Shanyi Investment Co., Ltd.
2024-06-07
Mobiveil’s PSRAM Controller IP Lets SoC Designers fully Leverage AP Memory’s Ultra High Speed (UHS) PSRAM Memory
5x Higher Performance Gains Over traditional PSRAM Devices
3X Lower Power Compared to DRAM
Close to 3X Fewer Pin Counts
2024-03-21
AP Memory S-SiCapTM Gen3, high density silicon capacitor, has passed customer validation
AP Memory, a leading global design company providing customized memory solutions, announced today that the new generation stack silicon capacitor (S-SiCapTM) Gen3 has passed customer validation.
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