Depending on system design requirements, deep trench capacitors can be integrated into the interposer, substrate, or landside in an advanced package to support power integrity needs of AI and HPC systems.
HSINCHU, TAIWAN — October 22, 2026 — United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”) and AP Memory (TWSE: 6531) today announced a technology and manufacturing collaboration to advance power delivery solutions for AI and high-performance computing (HPC) systems. This partnership combines UMC’s deep trench capacitor (DTC) foundry technology and scalable wafer manufacturing with AP Memory’s silicon capacitor designs and system-level integration to address the power efficiency challenges of next-generation data centers.
Rapid scaling of AI workloads is placing unprecedented demands on power delivery within computing systems, driving an architecture shift in data center design from placing power stabilization components on the circuit board to embedding capacitors directly in the interposer or substrate. This innovative approach shortens the power delivery path, improves power integrity, and supports more efficient voltage regulation within advanced packages.
The collaboration reached a significant milestone in the third quarter of 2026, with AP Memory’s S-SiCapTM Gen2D discrete silicon capacitor designs completing tape-out and initial functional validation. The next step is to proceed to comprehensive system-level performance and reliability testing of capacitors in substrate packages, targeting support for a range of capacitance and operating voltage requirements. UMC and AP Memory are also exploring opportunities to extend the collaboration to other product lines including capacitor-embedded interposers and landside capacitors to address diverse system designs.
GC Hung, Senior Vice President of UMC, said: “The growth of AI and HPC is driving a fundamental shift in power delivery – from board-level towards increasingly vertical power integration on the chip-level. UMC is offering robust power delivery solutions, including our DTC technology, which enables high-density capacitance to be placed closer to the computing die for more stable power delivery. By partnering with AP Memory, we are helping to bring scalable solutions to the market to solve the critical power bottleneck challenges as AI infrastructure continues to evolve.”
Ivan Hong, President of AP Memory, said: “The successful tape-out and initial wafer validation of our customized S-SiCapTM products using DTC technology represents an important milestone in demonstrating the flexibility and manufacturability of AP Memory’s S-SiCapTM design. By working with UMC, we are providing our customers a total solution, from product design to wafer manufacturing.”
UMC’s power delivery solutions roadmap covers both discrete and embedded silicon capacitors that can be applied to different system architectures, and extends to active components such as internal voltage regulators. UMC is also leveraging its advanced packaging capabilities to enable higher-density integration of power components to meet the higher voltage and capacitance requirements of next-generation data centers. In parallel, UMC is further investing in new manufacturing capacity to support both power delivery and heterogeneous integration solutions.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.
Media contact
UMC ｜Michelle Yun
886-3-578-2258 x16951
michelle_yun@umc.com
AP Memory ｜Kenny Chen
886-3-5601558 x 8396
kenny.chen@apmemory.com