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2026-10-22
UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems
United Microelectronics Corporation and AP Memory today announced a technology and manufacturing collaboration to advance power delivery solutions for AI and high-performance computing (HPC) systems. This partnership combines UMC’s deep trench capacitor (DTC) foundry technology and scalable wafer manufacturing with AP Memory’s silicon capacitor designs and system-level integration to address the power efficiency challenges of next-generation data centers.
2025-12-17
AP Memory Broadens S-SiCapTM Technology Deployment to Support Evolving AI and HPC Needs
The S-SiCapTM portfolio includes two product categories —discrete silicon capacitors and interposers with silicon capacitors — designed to support different system architectures and diverse application requirements.
2025-09-09
AP Memory Launches ApSRAMTM – A New Low-Power and High-Performance PSRAM
ApSRAMTM is an advanced version of AP Memory’s PSRAM with a new architecture optimized for edge computing and IoT applications, delivering low power consumption, low latency, and high performance.
2024-06-07
Mobiveil’s PSRAM Controller IP Lets SoC Designers fully Leverage AP Memory’s Ultra High Speed (UHS) PSRAM Memory
2024-03-21
AP Memory S-SiCapTM Gen3, high density silicon capacitor, has passed customer validation
AP Memory, a leading global design company providing customized memory solutions, announced today that the new generation stack silicon capacitor (S-SiCapTM) Gen3 has passed customer validation.
2023-04-11
Mobiveil’s PSRAM Controller IP Lets SoC Designers Leverage AP Memory’s Xccela x8/x16 250 MHZ PSRAM Memory
Gains of 10x Higher Density Over eSRAM, 10x Lower Power Compared to Standard DRAM With Close to 3x Fewer Pin Counts.
