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Company Profile

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History

AP Memory is a fabless IC design and marketing company. We are a world leader in Pseudo-SRAM. We are also leading the world in AI memory solutions, particularly for 3D IC. Our headquarters is located in Hsinchu, Taiwan, with R&D centers in the US, China, Japan, and sales offices worldwide.

R&D Teams

Members of our R&D teams mainly come from a number of industry leaders such as Intel, Cypress, Qimonda, Mitsubishi, among others. Armed with strong development capabilities, we provide customized/optimized memory solutions to a wide range of applications.

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Milestones
2022
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June

Joins the UCIe Industry Consortium to Promote AP Memory’s VHM™ and Contribute to Global Chiplet Ecosystem.

2022
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June

Launches brand-new product series of 512Mb Ultra-High-Speed (UHS) and 32Mb Ultra-Low-Swing (ULS) PSRAM.

2022
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February

Collaborates with Synopsys to Deliver Scalable IoT RAM (QSPI, OPI & HPI PSRAM) Memory Solutions.

2022
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January

Issuance of GDRs, with a total of 12,800 thousand shares of the common stock raising US$189,760 thousand in cash.

2021
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October

The par value of each share was changed from NT$10 to NT$5.

2021
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October

Accumulated shipment volume exceeded 6 billion.

2020
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August

AP Memory Joins NXP Partner Program.

2020
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May

Accumulated PSRAM shipment volume exceeded 5 billion.

2019
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December

Accumulated PSRAM shipment volume exceeded 4 billion.

2018
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June

AP Memory Technology (Hangzhou) Limited Co. founded, a 100% subsidiary.

2016
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June

Accumulated PSRAM shipment volume exceeded 3 billion.

2016
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May

Officially listed and traded on the Taiwan Stock Exchange.

2015
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February

Accumulated PSRAM shipment volume exceeded 2 billion.

2013
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September

Accumulated PSRAM shipment volume exceeded 1 billion.

2012
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March

AP Memory Corp., USA founded, a 100% subsidiary.

2011
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August

AP Memory Technology Corp. founded in Zhubei City, Hsinchu County.

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Core Business

AP Memory's main product is Pseudo SRAM and focuses on developing mobility memory products. Our PSRAM product has an 80% coverage rate in feature phones market.

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Future Development

AP memory also participates in the low-power DRAM design and development actively. Leveraging the expertise in designing low cost, small size, and low power consumption memory solutions, our products are widely applied in the smartphones and mobile devices.

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Executives
Chen, Wen-Liang
CEO & CTO
  • Ph.D., Yale University (Applied Physics)
Hung, Chih-Hsun
President
  • Ph. D., National Yang Ming Chiao Tung University (Industrial Engineering and Management)
Liu, Chin-Hung
Vice President
  • M.S., National Yang Ming Chiao Tung University (Applied Chemistry)
Lin,Yu-Hsin
CFO & Speakman
  • M.S., National Chengchi University(Accounting)
Liu, Tsung-Ning
Assistant Vice President
  • M.S., Stanford University (Electrical Engineering)
Fan, Yu-Chuan
Assistant Vice President
  • M.S., University of Chinese Academy of Sciences (Computer Architecture)
Huang, Wei-Cheng
Assistant Vice President
  • B.S., Kao Yuan University (Electrical Engineering)
Hung, Mao-Chuan
Accounting and Finance Supervisor
  • M.S., National Taipei University(Accounting)
Hong, Shu-Ling
Corporate Governance Supervisor
  • B.S., Soochow University (Accounting)
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Enriching new experience everyday

Starting from the beginning to now, the cumulated shipment volume is over billions, especially, the KGD product is more than 5 billion.